Bently 133819-01 60小卡 RTD/TC Non‑Isolated Rear I/O Small Card (Internal Terminations) for 3500‑60 Temperature Monitor

Description

Hardware Specifications

• Part Type: Rear I/O small card, must pair with 3500‑60 front monitor module, cannot operate independently
• Mounting: Installed at rear slot position of 3500‑05 rack, front‑rear separated architecture
• Termination: On‑board built‑in wiring terminals, no extra terminal block required; supports 6‑channel RTD and TC sensor inputs
• PCB: Conformal‑coated multilayer printed circuit board for harsh industrial environment
• Mechanical: Standard 3500‑series rear small‑card form factor, net weight approx. 0.45 kg
• Environmental: Operating temperature ‑30 ℃ ~ +65 ℃; storage temperature ‑40 ℃ ~ +85 ℃; vibration and shock performance complies with API‑670 machinery protection standard
• Electrical: Non‑isolated temperature signal interface, performs signal routing between field sensors and front‑end processing module, no built‑in signal isolation function.

Core Functions

1. Serves as physical wiring interface for 3500‑60 temperature monitor, receives RTD and thermocouple field signals and routes them to the corresponding front‑end processing module.
2. Provides 6‑channel signal routing for temperature measurement points, establishes physical signal path between field sensor cables and rack internal backplane bus.
3. Supports both RTD and TC input types; channel configuration is completed on front‑end 3500‑60 module, this rear card only implements hardware‑level signal conduction.
4. No on‑board microprocessor; all channel diagnosis, alarm logic and threshold processing are executed by paired front‑end monitor module.
5. Delivers temperature acquisition for TSI machinery protection system, applied to bearing and stator temperature monitoring of steam turbines, compressors and gas turbines.

Installation Requirements

1. Mandatory one‑to‑one slot matching with compatible 3500‑60 front module; mismatched part numbers will result in channel failure or abnormal reading.
2. Perform card insertion‑removal under rack power‑off condition. Although the 3500 rack supports hot‑swap for front modules, rear I/O small‑card replacement shall be completed with power cut‑off to avoid signal transient disturbance.
3. Ensure proper torque for field wiring terminals; loose connections will cause temperature signal drift, intermittent faults and false alarms.
4. Keep adequate cabinet ventilation; avoid direct exposure to corrosive gas, oil mist and conductive dust to prevent PCB trace corrosion and terminal oxidation.
5. Verify backplane connector integrity before installation; bent or contaminated pins may lead to partial‑channel loss or unstable communication between front‑rear modules.